In a speech delivered to the Industrial Advisory Committee today, Laurie E. Locascio, the Under Secretary of Commerce for Standards and Technology and Director of the National Institute of Standards and Technology (NIST), will announce the appointment of five distinguished leaders who will join the CHIPS Research and Development Office as part of the CHIPS for America initiative. The purpose of CHIPS for America, established through landmark legislation, is to bring semiconductor manufacturing back to the United States and solidify the nation’s position as a global leader in technology and innovation.Secretary of Commerce Gina Raimondo stated, “While the manufacturing incentives of the CHIPS Act will bring semiconductor manufacturing back to the U.S., the CHIPS R&D programs will ensure America’s global leadership by creating a robust semiconductor R&D ecosystem. These leaders possess the necessary organizational, programmatic, and technical expertise that CHIPS requires to establish new and transformative R&D initiatives.”Locascio expressed the vision of building a national R&D ecosystem that will maintain the technological advancement of the growing semiconductor manufacturing base. She emphasized the need for the nation’s top talent to execute the CHIPS R&D programs and drive progress for CHIPS for America and the semiconductor sector.The newly appointed leaders of the CHIPS Research and Development (R&D) Office are as follows: Lora Weiss as Director, Eric Lin as Deputy Director, Neil Alderoty as Executive Officer, Richard-Duane Chambers as Associate Director for Integration and Policy, and Marla Dowell as Director of the CHIPS R&D Metrology Program.CHIPS for America encompasses both the CHIPS Program Office, responsible for semiconductor incentives, and the CHIPS R&D Office, responsible for four integrated programs aimed at generating innovative advancements to enhance the global competitiveness of American semiconductor manufacturers. These programs include the National Semiconductor Technology Center (NSTC), the National Advanced Packaging Manufacturing Program, up to three new Manufacturing USA institutes dedicated to semiconductors, and the CHIPS R&D Metrology Program. READ MORE